Copper foil

Copper foil is a type of anionic electrolytic material, which is a thin, continuous layer of metal foil deposited on the substrate layer of a circuit board. It serves as a conductive material for PCBs. It is easy to adhere to the insulation layer, accept the printed protective layer, and form a circuit diagram after corrosion.

Copper foil has low surface oxygen characteristics and can adhere to various substrates, such as metals, insulation materials, etc. It has a wide temperature range of use. Mainly used for electromagnetic shielding and anti-static, conductive copper foil is placed on the substrate, combined with a metal substrate, which has excellent conductivity and provides electromagnetic shielding effect. It can be divided into: self-adhesive copper foil, double conductive copper foil, single conductive copper foil, etc.

The processing method of copper foil

The processing methods of copper foil include coating, rolling, and copper plating, among which rolling is the main processing method of copper foil.

Rolling is the process of rolling copper billets into plastic copper foils through a rolling mill, which involves multiple passes of cold rolling and annealing. During the production process of copper foil, it is necessary to continuously adjust the parameters of the rolling equipment to ensure the thickness, width, and flatness of the copper foil.

3、 The production process of copper foil

The production process of copper foil includes multiple steps such as copper billet melting, casting, rolling, annealing, and vertical cutting. The most important steps are rolling and annealing.

After melting, the copper billet is cast into a copper plate billet. Then, the copper plate blank is rolled into copper foil by rolling. The rolled copper foil also needs to undergo annealing treatment to improve its toughness and plasticity. Finally, cut the copper foil vertically into the required specifications.